Sales & Service to the PCB Industry
 
 
Vapour Phase Reflow - Vac 665 Vacuum
 


Vapour Phase with Vacuum - Model Vac 665
For Power modules, Power components and Hybrids
Can be converted to in-line.
 
 
IBL Löttechnik, one of the leading suppliers of Vapour Phase Solder Reflow machines, in co-operation with the German Fraunhofer Institute, have designed a machine which combines the advantages of Vapour Phase with the characteristics of a vacuum process. The result is a patented extremely unique machine, the IBL Vac665.
 
 
 
 
Process Cycle
   
The vacuum chamber closes around the module as the soldering is taking place.
 
 
 
Evacuation of the vacuum chamber
 
 
For the reduction of voids (Patent pending)
 
Without vacuum
 With vacuum
 
 
Combining the vacuum process with Solder Reflow in one chamber improves the heat transfer.

This will increase the reliability of small components (e.g. µBGA's) and semi-conductors (Power electronics).
 
 
ADVANTAGES
Reduction of voids, for even large area soldering.
Evacuation of the modules whilst in the Vapour Phase.
During the evacuation (vacuum process) temperature will be over liquidous at all times.
Maximum process window at min. temperature. (Lead-free solder max. Temp. 240°C.)
 
 
SPECIFICATION
- Vac665 (Batch model) Vac665i (In-Line model)
Depth 2300 mm. 2800 + 300 mm. table
Width 1200 mm. 2050 (Line length)
Height 1500 mm. 1500 mm.
Approx. Inlet /outlet height 950 mm. 950 mm.
Max. PCB size (manual loading) 640 x 650 x 80 mm. 640 x 650 x 80 mm.
Max. PCB size (In-line mode) - 640 x 600 x 60 mm.