![]() |
|
|
|
|
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
![]() |
||||||
Vapour Phase Reflow - Economy Range | ||||||
![]() |
||||||
![]() |
||||||
SV260 (Table-Top) | ||||||
![]() |
||||||
Desktop
unit ideal for laboratory and small-scale production runs. This system has been developed for users who have an occasional requirement for condensation reflow soldering; small production runs, or who those would like to use Vapour Phase for repairs. The SV 260 is an ëeconomyí type machine, whereby the whole heat process is accomplished in the vapour. Heat up and soldering time can be controlled either manually or with built-in automatic timer. The system consists of 2 chambers, one for the vapour phase process, one for cooling. The design of the cooling chamber with heat exchangers on the inside minimizes chemical loss and keeps operating costs low. The machine is ready for use after approximately 15 min. |
||||||
![]() |
||||||
Standard
Equipment / Specification Automatic air lock. Observation window to process chamber Integrated lighting of soldering area. Temperature monitoring of the cooling water. Temperature control with thermocouple. Level control of vapour Cooling Chamber Automatic fluid level indicator Program storage Integrated heat exchanger for minimizing liquid agent loss. Variable energy control system Maintenance free transport system (patented). |
||||||
![]() |
||||||
Options
Stainless steel grid for the WPC, grid space2mm Adaptor unit for double sided reflow ReSy device, for repair of QFPs &BGAs (Patented) Special adhesive for ReSy. |
||||||
![]() |
||||||
Technical
Data Width: 760mm Depth: 720mm Height: 600mm Weight approx: 50 kg Max. PCB size: 300 x 260 x 60 mm. Liquid filling agent: 3 kg Water connection: ½î Max. Heating cap.: 1,8 kW Power consumption/Std. 0,8 kWh Power supply: 230 VAC, 2 kW Main fuse: 16A, Typ ìgLî or ìCî |
||||||
![]() |
||||||
|
||||||
![]() |
||||||
![]() |
||||||