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| Vapour Phase Reflow - MiniLab (Patent pending) | ||||||
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| MiniLab System (Table-Top) | ||||||
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| Desktop
unit ideal for laboratory and rework. This system although compact, is a fully functional vapour phase soldering machine. It has been designed and developed for users who have an occasional requirement for condensation reflow soldering; product developers, small production runs, or who those would like to use Vapour Phase for repairs. |
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| Standard
Equipment / Specification Observation window to process chamber Variable energy level set-up Automatic Soldering Integrated lighting of soldering area. Temperature monitoring of the cooling water. Temperature control of heater surface. Automatic fluid level indicator Integrated heat exchanger for minimising liquid agent loss. Stand-by mode Maintenance free transport system (patented). |
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| Options
Adaptor unit for double sided reflow ReSy device, for repair of QFPs &BGAs (Patented) Special adhesive for ReSy. |
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| Technical
Data Length: 730mm Width: 600mm Height: 600mm Weight approx: 50 kg Max. PCB size: 300 x 275 x 60 mm. Liquid filling agent(min): 2 kg Water connection: ½î Max. Heating cap.: 1,8 kW Power consumption/Std. 0,8 kWh Power supply: 230 VAC, 2 kW Main fuse: 16A, Typ ìgLî or ìCî |
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