Sales & Service to the PCB Industry
 
 
Vapour Phase Reflow - SLC/BLC Batch Range - Premium Series
 

BLC509 (Batch Type - Manual Loading)
All SLC/BLC machines can be converted to in-line.
 
 
Application
Model No.
Max. Board Size
VP soldering machines
for laboratory & small boards/runs.
SLC 309
300 x 340 x 80 mm.
VP soldering machines, batch type, hand loaded,
mid size through-put.
Can be upgraded to in-line working machine.
SLC 509
SLC 609
SLC 809
540 x 340 x 80 mm.
640 x 340 x 80 mm.
840 x 340 x 80 mm.
VP soldering machines, batch type, hand loaded.

Other sizes on request e.g.
BLC 509
BLC 609
BLC 809
.
.
540 x 540 x 80 mm.
640 x 540 x 80 mm.
840 x 540 x 80 mm.
640 x 650 x 80 mm.
840 x 650 x 80 mm.
Can be upgraded to in-line    
 
 
PREMIUM SERIES
The Premium series has been designed for any type of soldering demand. Additional features compared to the Economy series increase the flexibility and scope of the machines. Every board can be soldered; no matter how complicated it is, without being overheated. The Premium series is available in a wide range of machine sizes.

Handling
The loading and unloading of the in-line machines is conducted outside of the process chambers, ensuring trouble-free production.

Soft Vapour Phase (SVP) (patented)
The SVP process mode enables variable temperature profile adjustments for a wide range of soldering demands. Live temperature profile monitoring, documentation and optimization with IBL Software VP-Control (all data is universally compatible).

Temperature Profiles
The patented Soft Vapour Phase (SVP) allows adjustment of temperature profiles to nearly any required temperature gradient. Safe soldering for lead-free solder can be achieved with temperatures up to 230ºC.

For more exacting specifications the SVP mode enables the user to create “Plateau” profiles or to generate low temperature gradients. The IBL software ‘VP-Control’ enables you to monitor the process data and import the information into programs such as EXCEL.

Rapid Cooling System (RCS) (patented)
This unit provides the fastest possible way of cooling immediately after soldering.

The RCS was developed to shorten the time from soldering to solidification of the solder joints. A cooler unit inside the vapour chamber provides cooling rates up to 5K/sec. This is particularly advantageous to the metallurgical structure of the solder joints, especially if heavy boards with a large mass are being soldered.

In view of the higher temperatures required when soldering lead-free (230ºC) a fast cool down for the first few seconds after soldering has even greater significance then when soldering SnPb.

In-line module (patented)
The SLC and BLC batch machines can be upgraded to fully automated in-line production, enabling the machine to be placed in a production line next to pick & place equipment. Multi-line loading of the carrier is also available.

Low maintenance costs
No weekly or monthly operator maintenance is required. Standard servicing requirements are just one annual service per one shift working. Machine design assures lowest liquid and lowest energy consumption.