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| Vapour Phase Reflow - LV 600 | ||||||||||||||||||||||||||||||||||
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 LV600 (In-Line / Auto-Loading) |
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| In-Line
Vapour Phase Soldering Machine LV 600 for High Volume Production The LV 600 machine is designed for fully automatic in line-operation. Two independent stations for loading and unloading the carrier guarantee maximised throughput. The time limit is given mainly from the soldering process itself. The loading and unloading is done while another carrier is on its way through the soldering procedure. With multi-line-loading (multiple lines of boards are loaded on one carrier) an optimised number of boards can be loaded on a carrier. The carriers can enter the machine at a rate as little as 120 sec. Depending on the board size it means that boards can be loaded and soldered in time rates below 20 seconds per board. The LV 600 has the same working modes and settings used on the IBL batch type machines. In that way it is possible to program the machine to take into account the behaviour of different solder pastes. Because of the integrated IR-preheat zone the machine can also be set up to be used for glue hardening of boards. The loading and unloading of the boards is done completely outside the soldering chambers. Thus error free handling is achieved and the loading modules are easy to reach and simple to adjust if necessary. As standard set-up the carriers are equipped for loading three lines. A carrier can be loaded in one single line if a big board is to be soldered but can also be used for loading boards in four lines. The machine is controlled by a PLC, its handling is done by means of a flat panel touch screen display. A PC is installed for saving the process data or the storage of program and manufacturing data. Also the machine status is shown on display and program editing can be accomplished very easily. |
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| Standard
Equipment / Specification Automatic loading and unloading of the carriers. Selective possibility of loading of batch carriers. Three internal chambers with automatic air locks SMEMA-Interface. IR heater unit for extended preheating from above. SVP for soft temperature rise (Patented). Observation window to process chamber. Integrated lighting of the soldering area. Automatic liquid agent filtering. Double control for monitoring the cooling water temperature. Temperature control of heater surface with thermocouple. Integrated cooling chamber for board cooling. Fluid level check. Automatic WPC-Temperature compensation. Program storage. Program set-up for glue hardening Signal lights post (red-green) Integrated heat exchangers for minimising and fluid recovery system. Variable energy level set-up. Maintenance free high-grade steel transportation system. (Patented). Patented process procedure Integrated PC with TFT-Panel and Software "LV-control" |
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| Options Display indicator for the height of the vapour level. Automatic adjustment of line width and middle support rails on the carriers. ReSy device licence, for repair of QFP's and BGA's, (Patented) Special adhesive for ReSy. Additional batch type carrier for manually loading Additional multi line carrier for 3 lines with middle support Module for remote software maintenance. S7-DP/DP-coupling unit for connection of 2 PROFIBUS-DP-networks Customise line integration Every option can also be retrofitted |
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