Vapour Phase Reflow SLC BLC In-Line Range

Vapour Phase Reflow - SLC/BLC In-Line Range - Premium Series

SLC 509i (In-Line) - These machines are also available as batch units.

Application	Model No.	Max. Board Size
VP soldering machines for in-line use. For mid size volume production.	SLC 309i SLC 509i SLC 609i SLC 809i	300 x 300 x 50 mm. 540 x 300 x 50 mm. 640 x 300 x 50 mm. 840 x 300 x 50 mm.
VP soldering machines for in-line use. For high volume production.	BLC 509i BLC 609i BLC 809i	540 x 400 x 50 mm. 640 x 400 x 50 mm. 840 x 400 x 50 mm.
Other sizes on request.	.

PREMIUM SERIES
The Premium series has been designed for any type of soldering demand. Additional features compared to the Economy series increase the flexibility and scope of the machines. Every board can be soldered; no matter how complicated it is, without being overheated. The Premium series is available in a wide range of machine sizes.

Handling
The loading and unloading of the in-line machines is conducted outside of the process chambers, ensuring trouble-free production.

Soft Vapour Phase (SVP) (patented)
The SVP process mode enables variable temperature profile adjustments for a wide range of soldering demands. Live temperature profile monitoring, documentation and optimization with IBL Software VP-Control (all data is universally compatible).

Temperature Profiles
The patented Soft Vapour Phase (SVP) allows adjustment of temperature profiles to nearly any required temperature gradient. Safe soldering for lead-free solder can be achieved with temperatures up to 230ºC.

For more exacting specifications the SVP mode enables the user to create “Plateau” profiles or to generate low temperature gradients. The IBL software ‘VP-Control’ enables you to monitor the process data and import the information into programs such as EXCEL.

Rapid Cooling System (RCS) (patented)
This unit provides the fastest possible way of cooling immediately after soldering.

The RCS was developed to shorten the time from soldering to solidification of the solder joints. A cooler unit inside the vapour chamber provides cooling rates up to 5K/sec. This is particularly advantageous to the metallurgical structure of the solder joints, especially if heavy boards with a large mass are being soldered.

In view of the higher temperatures required when soldering lead-free (230ºC) a fast cool down for the first few seconds after soldering has even greater significance then when soldering SnPb.

Multi-Line Module
For volume production, machines can be equipped for automatic loading and unloading. This option can also be added to a batch machine at a later date.

Flexibility of board handling makes it possible to change form in-line to batch loading. When the machine is operating in automatic in-line mode, you are also able to hand load single boards into the machine. (E.g. for repair of single boards). The module is designed for multi-line loading of the carrier. Standard loading and unloading is 2 boards per stroke.

The loading/unloading operation is performed outside of the machine entrance door; consequently the handling unit remains free of flux deposits and from heat stress. The result of this is that it requires virtually no maintenance.

The short machine length makes it ideal to be integrated into an in-line unit. The board throughput that can be achieved with these relatively small machines is comparable to much larger systems.

Optional adjustment of line width
Automatic adjustment of line width and middle support rails on WPC. Selected from pre-stored line width data.

Optional adjustment of conveyor belts
Automatic line width adjustment of conveyor belts in load/unload unit corresponding to the data of the WPC.

Low maintenance costs
No weekly or monthly operator maintenance is required. Standard servicing requirements are just one annual service per one shift working. Machine design assures lowest liquid and lowest energy consumption.