|
1.
|
No
need to set up temperature profiles as condensing vapour transfers
heat.
|
|
2.
|
The
solder process can be reliably reproduced and provides ideal conditions
for process control, even in the long term.
|
|
3.
|
It's
impossible to heat components to a higher temperature than the
condensing vapour. (e.g. 200°C for SnAg, or 230°C for lead
free alloys).
|
|
4.
|
Allows
you to change to lead-free solder alloys immediately.
|
|
5.
|
The
vapour provides a 100% inert gas atmosphere.
|
|
6.
|
Enables
soldering to be carried out on a wide range of assemblies, from
flexible circuits to very thick, densely populated multi-layers,
consistently and without any overheating.
|
|
7.
|
Trouble
free single circuit board assembly manufacturing.
|
|
8.
|
Uniform
temperature distribution across the entire PCB.
|
|
9.
|
Delamination
of boards will not occur.
|
|
10.
|
Components
of all types can be reliably soldered.
|
|
11.
|
Due
to the low maximum temperature danger of popcorn cracking is minimised.
|
|
12.
|
Optimal
preheat on top or below the PCB.
|
|
13.
|
Optional
rapid cooling system for minimising growth of inter-metallic phases.
|
|
14.
|
Environmentally
compatible - less aggressive flux vapour than in other forms of
reflow.
|
|
15.
|
Low
operating costs due to minimised liquid drag out.
|
|
16.
|
Integrated
cooling system based on air convection.
|
|
17.
|
Simultaneous
soldering - makes new production techniques possible.
|
|
18.
|
Repair
is easy; de-soldering is accomplished without damaging PCB or
components.
|
|
19.
|
Window
for observation of the soldering process.
|
|
20.
|
Machines
available in a variety of formats.
|
|
21.
|
Ready
for soldering in 14-20 minutes.
|
|
22.
|
Minimal
maintenance requirements.
|
| 23. |
Currently
the most cost effective reflow soldering process. |
|
24.
|
Use
one machine for SnPb & Lead-free, no modification required.
|
