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| Vapour
Phase Reflow - Rework Tool |
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'ReSy'
Rework Tool
For Automatic Removal of BGAs & QFPs in an IBL Vapour Phase reflow oven. |
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Useable
with every IBL Vapour Phase machine Patented procedure for repair of SMD
components Repairs without damaging either board or component.
Can be used again and again. |
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a cold state the desoldering stamp is fixed to the component with a high
temperature adhesive tape. Then the whole unit is transported into the
vapour phase area. |
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After
the solder joints have melted, the component is automatically lifted from
the board.
Neither the component or the board will be damaged and can be used again. |
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