Many
manufacturers of advanced SMT assemblies rely on Glenbrook’s real-time
X-ray technology to evaluate solder joint integrity for BGAs and other
leadless packages that cannot be inspected by conventional vision systems.
For assemblers who measure BGA solder voids to determine quality, Glenbrook’s
patented X-ray camera offers a unique advantage: it is the only system
not subject to Voltage Blooming. Void sizes remain consistent at
all voltages, providing reliable pass/fail data.
As an alternative to large packages with high pin counts, ball grid arrays
(BGAs) have distinct benefits: smaller size, lower inductance, reduced
coplanarity and lack of skewing. But once a BGA is placed, how can the
integrity of its solder bond be measured?
Many manufacturers of advanced SMT assemblies rely on Glenbrook's real-time
X-ray technology to evaluate solder joint integrity for BGAs and other
leadless packages that cannot be inspected by conventional vision systems.
In the course of working with our systems, these manufacturers have verified
a fundamental principle of productive assembly: it's more effective
to inspect the process, rather than the product.
Real-time X-ray inspection helps to establish quality as an integral part
of your process, right from the start, and to maintain it throughout your
line, for BGA evaluation or any other aspect of the process. In the development
stage, real-time X-ray inspection defines the optimal parameters required
to maintain a process in control. During production audits, it ensures
that those parameters are being maintained. |
