Sales & Service to the PCB Industry
 
 
X-Ray Inspection - The Glenbrook Jewel Box Series
 
Jewel Box 70-T
Jewel Box 90-C
 
Glenbrook’s Jewel Box systems, designed for demanding applications, are used in the world’s most discriminating laboratories and research facilities for product development, failure analysis, non-destructive testing and research.

Glenbrook has incorporated ultra-high resolution, powerful microfocus x-ray tubes, five-axis positioners and sophisticated software into systems that are typically half the size and half the cost of other systems with similar specifications.

The Jewel Box Series is divided into two broad categories, the Jewel Box 70-T and Jewel Box 90-C, each of which can be adapted or customized for specific applications:

The Jewel Box 70-T delivers magnification up to 500X.

The Jewel Box 90-C provides ultra-high magnification up to 2000X.
 
 
Both product lines use the patented MXRA x-ray camera, which is unequaled in its ability to image soft materials such as plastics, polymers, collagen and rubbers, as well as other low-density materials, including ceramics and titanium.

High-Resolution Inspection for Electronics Fabrication Applications

When used with the GTI-5000 Image Processing Workstation, Jewel Box x-ray inspection systems become powerful tools to evaluate electronic components, including BGAs, Micro-BGAs and flip chips.
 
 
Glenbrook's Jewel Box delivers superior image quality - with excellent resolution and sensitivity - for laboratory and failure analysis applications. The system's high-resolution X-ray camera and 10-micron MicroTech X-ray source provide magnification from 15X up to 500X, with resolution of 100 line pairs/mm.
 
 
Progressive magnification allows inspection of multiple details.
 

24X view of an IC

The same IC at 65X
   
   

At 250X, ball bonds may be inspected

Also at 250X, wedge bonds are revealed
 
With these advanced capabilities, the desktop Jewel Box produces images comparable to those from X-ray inspection systems that are ten times larger in size, and five times higher in cost.
 
 
High-resolution inspection applications:
sample images of defects as viewed on the Jewel Box
 

Image of a surface mounted IC permits inspection of the wires within the IC and the solder joint quality of the leads, revealing insufficient solder on the right-most lead.


Image of a
micro BGA,
rotated, reveals wire sweeps
and solder ball
shape.

  

Solder joints on a flip chip:
note the large number of
voids in each joint
and bridging
at the
left side.
 

Dimensional view of solder balls
pinpoints the precise location
of solder voids within the balls.

Die attach, showing voids
in the epoxy connecting the
silicon to the metal lead frame.
 
 
In addition to generating high-quality images of solder joints and bonds in advanced technology packages that cannot be verified by visual inspection., the Jewel Box has the sensitivity to inspect soft materials, such as molded plastics and encapsulants, as easily as components and electronic assemblies.

The transparent enclosure on all four sides of the Jewel Box allows easy viewing from any angle. The positioner features five-axis control, including 360° rotation and tilt. The quadratic proportional controller ensures precision control over the full range of posi-tioning speeds.

The Jewel Box employs Glenbrook's patented, award-winning X-ray camera technology . The system has a compact footprint and may be placed on a desk or countertop, or mounted on an optional wheeled cabinet base.