Wave Soldering Selective Soldering

Wave Soldering - Selective Soldering

Selective (partial) soldering system able to meet the future requirements in the growing niche market.

Component positioning
The XY alignment is accomplished by means of centering pins and the conveyor system.
The Z alignment is done with a support pin pad below and pneumatically controlled hold-down device above.

	The XY-fluxer The Piezo-electric flux-jet works similar to an inkjet printer. The flux is applied where needed, selectively and with the required quantity for the soldering process. The XY fluxer guarantees an application accuracy of +/- 1 mm.

	The conveyor module The conveyor module consists of two driven chains. Both rails are equiped with automatic height adjustment and are programmable. The conveying speed is also programmable in steps of 0,1 m/min.

	The pre-heater module For the activation of the flux, and in order to avoid filling problems in case of multilayer pcbs, a special pre-heater module is installed.

	Riser cleaning A pneumaticallly driven device is activated after each soldering step for the purpose of removing process-related impurities of the solder surface in the risers.

	Non-contact solder level monitoring The non-contact solder level monitoring is achieved through the use of a non-contact eddy-current sensor. Thus an exact adjustment of the solder metal level in the riser is possible at all times.

Technical Data

Connected load
Electrical connection: 230/400V +10%/ -15%, 50/60 Hz
Total connected load: = 6.8 kW
Fuse protection (customer):3 x 25 A slow-action
Compressed air:
Connection: ¼", Output: 5 - 6 bar constant, Quality: filtered 5µ, Consumption: app. 0.16 m³/h production-related
Exhaust air at top of chassis: Connection: 1 x Ø 200 mm, Capacity approx. 400 m³/h

Conveyor
Conveyor speed: Bolt chain conveyor: 0.4 - 3.75 m/min
Inlet/outlet height: 940 mm +/- 20 mm
PCB assembly size: Length max. 380 mm, Width min. 70 to max. 320 mm
Width adjustment: < 10 min
Component clearance for pin Chain support: 5 mm
Step time for individual PCB: < 25 s

Fluxer
Coordinate fluxer: Programmable, closed system
Dosing rate: yes
Fluxer accuracy: ± 1 mm

Preheater
Ceramic plates: 2 x 0.4 kW = 0.8 kW

Solder pot
Solder pot heater: 4 x 1.0 kW = 4.0 kW
Solder pot auxiliary heater: 1 x 0.5 kW
Solder pot temperature: 230° - 280° C
Solder filling: 280 kg
Solder heat-up time: app. 120 min
Solder pot stability: ± 1° C
Automatic solder refill:Solder wire Ø 6 mm, coil Ø 305 x 110 mm
Riser spacing per component: max. 120 mm lengthwise, max. 300 mm crosswise
Positioning and soldering accuracy: ± 0.1 mm
Component clearance (solder land spacing): min. 1 mm
Component height on PCB: max. 12 mm

Control
Robotronix-control: PC / MIS

Misc.
Sound level: < 65 dB
Other power consumers: 1.5 kW
Dimensions machine (l x w x h):2.39 x 0.9 x 1.3 m
Weight machine with solder filling: 630 kg
Colour Grey-White RAL 9002

Technical data subject to change without prior notice.