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| Wave Soldering - Mini Waver |
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| The Mini
Waver is a bench-top wave soldering system for leaded, SMD or mixed boards.
It is ideally suited for pre-production up to medium range production. |
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| The 8-hour throughput is typically 800 Euroboards of the size 100 x 160 mm (4 x 6.3”). |
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| Technical
Description Rugged design in steel frame and steel panelling: sturdy and durable Process area entirely covered by heat shield and exhaust hood: no fumes, little heat radiation Exhaust fan and flexible hose 3 m (9 feet) included: system ready for connection Foam fluxing unit includes built-in compressor: no need for compressed air, can be used anywhere Preheating zone with medium wavelength IR radiator, adjustable dwell time: preheating does not depend on soldering speed, i.e. important advantage, particularly with SMD and mixed boards Solder pot holds 38 kg of solder, heated from outside, heat-insulated: short heat-up time of approx. 90 minutes Solder pot, solder pumps, nozzles and flux unit made of stainless steel: durable 2 adjustable board carriers, with 2 spring clip rails each: useful board area 265 x 353 mm (10.5 x 13.9”), any smaller format possible Microprocessor-based control unit with 8 lines-LCD display, printer interface and storage capability for 64 soldering programs: straightforward and easy to use even for semi-skilled operators ISO 9000-capability Power consumption only 2200 W, single phase operation at 230 V/50 Hz |
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| Technical
Specifications Operating temperature range: 220...280 °C (428...536 °F) Regulating accuracy: ± 2 °C (± 4 °F) Solder pump drive: DC servo motor Control: microprocessor-based plug-in unit, solid state power switching Solder capacity: 38 kg Flux: any type of flux may be used Max. solder area: 265 x 353 mm (10.5 x 13.9”) Heat-up time to 255 °C (473 °F): approx. 90 minutes Mains requirements: 230 V/2,2 kW, single phase, complies with CE Dimensions: L x D x H = 1000 x 520 x 300 mm (39.5 x 20.5 x 11.8”) Weight, ready for operation: approx. 105 kg |
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