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| X-Ray Inspection - RTX-113HV | |||
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| A powerful real-time X-ray inspection system, designed specifically for rapid, reliable inspection of both multi-layer and assembled printed circuit boards with dense metal BGAs. | |||
| The
RTX-113HV system meets all your
needs for inspecting BGA packages, including many recently introduced
BGAs that contain dense metal heat sinks that require a higher voltage
X-ray source to clearly identify and troubleshoot production faults. In
response to the introduction of these newer BGA packages Glenbrook has
developed the new “HV” with a stronger 70kV X-ray tube that permits quality
inspection of these denser metal components. The remodelled cabinet design permits easy integration into even the busiest production environments, and is totally upgradable with many of the options listed below. |
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| Applications:
Multi-layer PCBs Small Hole Drilling Dense Metal BGA Inspection Backplane Boards Specifications: 1270mm. H x 1530mm. W x 840mm. D Operating Voltage: 120v/220v, 50-60hz Contrast Resolution: Can resolve .001 gold wire Spatial Resolution: 20lp/mm (with MicroTech TM option, up to 100lp/mm) Anode Voltage: 70kV Anode Current: 100 microamps (internal adjustment) Focal Spot Size: 0.2mm Focal Spot to Image Plane Distance: 4-6 inches X-ray Activation Mode: foot pedal or timer switch Options: Image Processing/Advanced transfer capabilities Video Printer XRTV Zoom Camera (4X-50X magnification) Micro-Tech TM 10-micron X-ray Source (225X) BGA and Void Measurement software Manual/Motorized X-Y positioner |
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