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| X-Ray Inspection - RTX-113 | ||||
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| A unique X-ray inspection system, designed for the rapid, reliable inspection of both multi-layer and assembled printed circuit boards. | ||||
| The RTX-113
is designed for heavy production environments where X-ray is used to inspect
PCBs and assembled PCBs containing advanced components such as BGAs, uBGAs
and Flip Chips. The system is very versatile and features Glenbrook's patented, award-winning X-ray camera technology that generates high-resolution, high-sensitivity images, revealing defects as small as 0.001 inch with a full one inch diameter field of view. The RTX-113 provides affordable real-time X-ray imaging, reliable operation and easy servicing. |
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Applications: Multi-layer PCBs Small Hole Drilling BGA Inspection Backplane Boards |
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| Specifications: 42"H x 42"W x 24"D (1066.8mm x 1066.8mm x 609.6mm) Operating Voltage: 120v, 60hz or 220v, 50hz Contrast Resolution: Can resolve .001 gold wire Spatial Resolution: 20 lp/mm (with MicroTech™ option, up to 100 lp/mm) Anode Voltage: 35-52kV Anode Current: 20-50 microamps (internal adjustment) Focal Spot to Image Plane Distance: 4-6 inches X-ray Activation Mode: foot pedal or timer switch |
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| Options: Image Processing/Advanced transfer capabilities XRTV Zoom Camera (4X-50X magnification) *Micro-Tech™ 10-micron X-ray Source (225X) BGA and Void Measurement software Manual/Motorized X-Y positioner Variable Angle Viewing allows 45 degree viewing *The MICROTECH model is designed for ultra-high resolution X-ray inspection requirements such as laser drilling of multi-layer PCBs and populated PCBs containing BGAs, uBGAs and Chip Scale Packages (CSPs). The high-powered system contains a 10 micron focal spot for inspecting 3 mil laser drilled holes. The MICROTECH RTX-113's X-ray tube permits magnification between 4X and 225X. An optional Video Measurement System can be easily integrated to enable users to accurately measure XY offset and hole-to-pad misalignment. |
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